Students and faculty from the Packaging Engineering Program at Rutgers University stopped by the booth of coding and printing company Adolph Gottscho Inc. (Union, NJ) at the Pack Expo tradeshow, held in November in Chicago, to visit one of the program's major benefactors.
Eva Gottscho, Adolph Gottscho's president has been a long-time supporter of the program and has made a pledge to help fund the construction of a new building to house the packaging engineering and biomedical programs at Rutgers. Groundbreaking on the 60,000-sq-ft building took place on September 4, 2002, and it is scheduled for completion in September 2004. The university says having the two programs in the same building will allow it to expand research, teaching, and course offerings in pharmaceutical and medical device packaging engineering, and provide students with a chance to become part of the workforce of New Jersey's pharmaceutical, medical device, and biotechnology industries.
